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2:06
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
得益于东芝最新的功率器件和数字隔离器，这款1U尺寸1.6kW服务器电源实现了比现有设计更高的效率。电路设计和操作的设计文件和指南可用作参考设计。
4:37
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体，为实现碳中和和抑制功耗增加做出贡献。
1:47
TB9032FNG is a physical layer interface driver receiver IC compliant with the CXPI automotive communication protocol standard. It contributes to vehicle lightweighting by reducing the wiring harnesses of HMI devices in vehicle.
2:41
该参考设计提供了eFuse IC应用电路的设计指南、数据和其他内容。该电路通过结合eFuse IC和Thermoflagger™ （过温检测IC）提供过温检测和精确的过流关断。
4:09
该参考设计提供使用SiC MOSFET的3相逆变器。SiC MOSFET能够高效驱动额定电压高达AC 440 V的电机。电路设计和操作的设计文件和指南可用作参考设计。
4:45
Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
13:36
