东芝向功率半导体的进步发起挑战
1:47
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东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体,为实现碳中和和抑制功耗增加做出贡献。
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1:47
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体,为实现碳中和和抑制功耗增加做出贡献。
Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
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The TB9033FTG is the industry's first CXPI interface IC with hardware logic for automotive communication standards. (Under development) This product contributes to shortening development period by eliminating the need for software development.
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S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
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得益于东芝最新的功率器件和数字隔离器,这款1U尺寸1.6kW服务器电源实现了比现有设计更高的效率。电路设计和操作的设计文件和指南可用作参考设计。
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这是一款高效的DC-DC转换器,可将服务器上的48 V总线电压转换为 1.2 V/100 A,供服务器中的各种设备使用。电路设计和操作的设计文件和指南可用作参考设计。
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The TB9M003FG integrates motor gate drivers, MCU, and peripheral components into a 1 chip. It also enables sensorless 1 shunt vector control, contributing to the miniaturization of ECU boards and systems, and simplifying board and system design.
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