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1:49
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体，为实现碳中和和抑制功耗增加做出贡献。
本视频介绍了使用MOSFET栅极驱动IC的电源多路复用器电路的参考设计。支持MBB／BBM模式切换，并且在小电路板上实现了理想的二极管特性。
3:59
该参考设计提供了eFuse IC应用电路的设计指南、数据和其他内容。该电路通过结合eFuse IC和Thermoflagger™ （过温检测IC）提供过温检测和精确的过流关断。
4:09
这是一款高效的DC-DC转换器，可将服务器上的48 V总线电压转换为 1.2 V/100 A，供服务器中的各种设备使用。电路设计和操作的设计文件和指南可用作参考设计。
3:36
TB9032FNG is a physical layer interface driver receiver IC compliant with the CXPI automotive communication protocol standard. It contributes to vehicle lightweighting by reducing the wiring harnesses of HMI devices in vehicle.
2:41
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
2:06
Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
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