评估工具和参考板

3kW Power Supply for AI Servers Using Surface-Mounted SiC MOSFET

Generative AI adoption is driving AI server demand. This design uses a 3 kW power supply and our SiC MOSFETs to deliver high power density.

3:44

1.1kW ITTF AC-DC Converter for Servers

Server power supplies are required to improve efficiency and reduce losses. This reference design is a high-efficiency power supply for servers that uses an (ITTF)Interleaved Two-Transistor Forward AC-DC converter and delivers up to 1.1 kW output.

4:10

3kW Power Supply for Electric Scooter Fast Chargers Using SiC MOSFET

Carbon neutrality drives electric scooter demand and fast charging needs. This reference design offers a 3kW power supply for electric scooter fast chargers.

3:49

3-Phase AC 400V Input Vienna Rectifier PFC Power Supply

3-phase 400V AC (common outside Japan) powers this PFC supply, converting to 750V DC. Using Vienna rectifier for efficient 3-level operation, it delivers up to 5kW.

3:12

3kW Power Supply for Servers and Telecoms Using Surface-Mounted SiC MOSFET

Power supplies for servers are now required to be more efficient, more powerful, and more space-saving, making high power density essential. By adopting our latest surface-mounted SiC devices, we have achieved high power density by separating the pow

3:56

Automotive 3kW 48V-12V Bidirectional DC-DC Converter

Bidirectional DC-DC converter required for the applications which have the 48V battery and the 12V battery achieves high efficiency operation by using Toshiba's

2:59

无绳电动工具逆变器参考设计

这款3相直流无刷电机驱动电路采用六个MOSFET（TPH1R204PB、TPH2R408QM）和一个栅极驱动IC（TB67Z833SFTG），实现了紧凑而高效的电机控制，并支持多种输入模式。本参考设计提供设计指南、数据和其他内容。

4:25

车载电机驱动栅极驱动IC

我们最新推出两款栅极驱动IC产品：分别是适用于有刷电机的 TB9103FTG 和适用于无刷电机的 TB9084FTG。他们专为汽车车身系统、电动泵和电动发电机应用设计。本视频展示了这两款产品的示例应用和功能。

5:28

Changing Transformer Parameters

0:56

嵌入微控制器的车载栅极驱动IC SmartMCD™——TB9M003FG

TB9M003FG将电机栅极驱动电路、MCU和外围组件集成到一块芯片中。支持无霍尔的1分流矢量控制，有助于实现ECU电路板和系统的小型化，简化电路板和系统的设计

4:53

CXPI应答器接口IC TB9033FTG

TB9033FTG是业界首款具有硬件逻辑并符合车载通信标准的CXPI接口IC（开发中） 该产品无需软件开发，有助于缩短开发周期。

2:38

车载MOSFET新封装介绍：DFN2020B(WF)

DFN2020B(WF)封装采用可焊锡侧翼引脚结构，可通过AOI设备确认可焊性。与SOT-23F封装相比，该封装在实现高散热性的同时，减少了约43%的贴装面积。

2:47