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2:21
L-TOGL™通过新的封装技术实现了大电流工作，以及行业领先的低损耗和低发热特性。
Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
13:36
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
2:06
The TB9M003FG integrates motor gate drivers, MCU, and peripheral components into a 1 chip. It also enables sensorless 1 shunt vector control, contributing to the miniaturization of ECU boards and systems, and simplifying board and system design.
4:56
该参考设计提供了eFuse IC应用电路的设计指南、数据和其他内容。该电路通过结合eFuse IC和Thermoflagger™ （过温检测IC）提供过温检测和精确的过流关断。
4:09
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体，为实现碳中和和抑制功耗增加做出贡献。
1:47
得益于东芝最新的功率器件和数字隔离器，这款1U尺寸1.6kW服务器电源实现了比现有设计更高的效率。电路设计和操作的设计文件和指南可用作参考设计。
4:37
