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4:53
TB9M003FG将电机栅极驱动电路、MCU和外围组件集成到一块芯片中。支持无霍尔的1分流矢量控制，有助于实现ECU电路板和系统的小型化，简化电路板和系统的设计
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体，为实现碳中和和抑制功耗增加做出贡献。
1:47
Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
13:36
Power supplies for servers are now required to be more efficient, more powerful, and more space-saving, making high power density essential. By adopting our latest surface-mounted SiC devices, we have achieved high power density by separating the pow
3:56
TB9033FTG是业界首款具有硬件逻辑并符合车载通信标准的CXPI接口IC（开发中） 该产品无需软件开发，有助于缩短开发周期。
2:38
Bidirectional DC-DC converter required for the applications which have the 48V battery and the 12V battery achieves high efficiency operation by using Toshiba's
2:59
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
2:06
