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2:21
L-TOGL™通过新的封装技术实现了大电流工作，以及行业领先的低损耗和低发热特性。
得益于东芝最新的功率器件和数字隔离器，这款1U尺寸1.6kW服务器电源实现了比现有设计更高的效率。电路设计和操作的设计文件和指南可用作参考设计。
4:37
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体，为实现碳中和和抑制功耗增加做出贡献。
1:47
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
2:06
The TB9033FTG is the industry's first CXPI interface IC with hardware logic for automotive communication standards. (Under development) This product contributes to shortening development period by eliminating the need for software development.
2:35
该参考设计提供了eFuse IC应用电路的设计指南、数据和其他内容。该电路通过结合eFuse IC和Thermoflagger™ （过温检测IC）提供过温检测和精确的过流关断。
4:09
Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
13:36
