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该参考设计可在半桥模式下控制两个电机，或在H桥模式下控制一个电机。可使用板载开关或外部MCU控制电机。本参考设计提供设计指南、数据和其他内容。
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DFN2020B(WF)封装采用可焊锡侧翼引脚结构，可通过AOI设备确认可焊性。与SOT-23F封装相比，该封装在实现高散热性的同时，减少了约43%的贴装面积。
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This video briefly introduces the functions of the Online Circuit Simulator, a MOSFET selection tool that can simulate circuits on the Web.
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The TB9M003FG integrates motor gate drivers, MCU, and peripheral components into a 1 chip. It also enables sensorless 1 shunt vector control, contributing to the miniaturization of ECU boards and systems, and simplifying board and system design.
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