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2:21
L-TOGL™通过新的封装技术实现了大电流工作，以及行业领先的低损耗和低发热特性。
The TB9033FTG is the industry's first CXPI interface IC with hardware logic for automotive communication standards. (Under development) This product contributes to shortening development period by eliminating the need for software development.
2:35
3:45
DFN2020B(WF)封装采用可焊锡侧翼引脚结构，可通过AOI设备确认可焊性。与SOT-23F封装相比，该封装在实现高散热性的同时，减少了约43%的贴装面积。
2:47
该参考设计可在半桥模式下控制两个电机，或在H桥模式下控制一个电机。可使用板载开关或外部MCU控制电机。本参考设计提供设计指南、数据和其他内容。
6:03
The TB9M003FG integrates motor gate drivers, MCU, and peripheral components into a 1 chip. It also enables sensorless 1 shunt vector control, contributing to the miniaturization of ECU boards and systems, and simplifying board and system design.
4:56
This video explains in detail how to use the Online Circuit Simulator, a MOSFET selection tool that can simulate circuits on a Web.
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