车载MOSFET新封装介绍:DFN2020B(WF)
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DFN2020B(WF)封装采用可焊锡侧翼引脚结构,可通过AOI设备确认可焊性。与SOT-23F封装相比,该封装在实现高散热性的同时,减少了约43%的贴装面积。
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2:47
DFN2020B(WF)封装采用可焊锡侧翼引脚结构,可通过AOI设备确认可焊性。与SOT-23F封装相比,该封装在实现高散热性的同时,减少了约43%的贴装面积。
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