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2:06
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
The TB9M003FG integrates motor gate drivers, MCU, and peripheral components into a 1 chip. It also enables sensorless 1 shunt vector control, contributing to the miniaturization of ECU boards and systems, and simplifying board and system design.
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3:45
This video briefly introduces the functions of the Online Circuit Simulator, a MOSFET selection tool that can simulate circuits on the Web.
1:39
The TB9033FTG is the industry's first CXPI interface IC with hardware logic for automotive communication standards. (Under development) This product contributes to shortening development period by eliminating the need for software development.
2:35
DFN2020B(WF)封装采用可焊锡侧翼引脚结构，可通过AOI设备确认可焊性。与SOT-23F封装相比，该封装在实现高散热性的同时，减少了约43%的贴装面积。
2:47
本设计用于大电流／高压SiC MOSFET模块的栅极驱动电路。它可安装在东芝双MOSFET模块上。提供电路设计和操作的设计文件和指南作为参考。
3:38
