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7:25
DFN2020B(WF) package which uses a wettable flank structure, allows for confirmation of solderability in AOI equipment. And it reduces the mounting area by approximately 43% compared to the SOT-23F package while achieving high power dissipation.
3:00
S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
2:06
该参考设计可在半桥模式下控制两个电机，或在H桥模式下控制一个电机。可使用板载开关或外部MCU控制电机。本参考设计提供设计指南、数据和其他内容。
6:03
该隔离栅极驱动电路配有各种保护功能，适用于3相逆变器，实现7合1电源模块的栅极驱动。本参考设计提供设计指南、数据和其他内容。
3:28
3:45
L-TOGL™通过新的封装技术实现了大电流工作，以及行业领先的低损耗和低发热特性。
2:21
