车载MOSFET新型SMD封装“S-TOGL™”介绍
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S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
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S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
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