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S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
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DFN2020B(WF)封装采用可焊锡侧翼引脚结构，可通过AOI设备确认可焊性。与SOT-23F封装相比，该封装在实现高散热性的同时，减少了约43%的贴装面积。
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该参考设计可在半桥模式下控制两个电机，或在H桥模式下控制一个电机。可使用板载开关或外部MCU控制电机。本参考设计提供设计指南、数据和其他内容。
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This video briefly introduces the functions of the Online Circuit Simulator, a MOSFET selection tool that can simulate circuits on the Web.
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The TB9033FTG is the industry's first CXPI interface IC with hardware logic for automotive communication standards. (Under development) This product contributes to shortening development period by eliminating the need for software development.
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该隔离栅极驱动电路配有各种保护功能，适用于3相逆变器，实现7合1电源模块的栅极驱动。本参考设计提供设计指南、数据和其他内容。
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