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Low Drop-out Regulator
Toshiba's LDO achieves industry's best-in-1 class ripple rejection ratio and load transient response. This helps to minimize output voltage fluctuations.
0:52
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Toshiba Low Voltage MOSFET U-MOS IX-H
U-MOS IX-H has achieved a best-in-class reduction of Ron・Qoss by adopting Process Technology and Packaging Technology. (*The best-in-class reduction : Surveyed by Toshiba Electronic Devices & Storage Corporation in December/2017)
2:12
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An introduction of High Voltage MOSFET, π-MOSⅨ Series
With an optimized chip design, the π-MOS IX series provides lower peak EMI noise than the current π-MOS VII series, while maintaining the same level of efficiency.
1:16
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Toshiba small discrete semiconductor products for USB Type-C™
Do you need any help for introduction of the Type-C connectors ? Toshiba will propose suitable semiconductor products in power line and data line around the Type-C connector according to customer’s usage conditions.
3:34
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The U-MOSⅨ-H 100V series low voltage MOSFETs
We succeeded in improving the efficiency of the U-MOSⅨ-H installed in a DC-DC converter by improving the trade-off between the ON resistance and the electric charge.
1:14
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The DTMOSⅥ series High-voltage MOSFET
TOSHIBA DTMOSⅥ series help to improve the efficiency of switching power supply by reduction of Ron・Qgd.
1:06
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Introduction of Toshiba Evaluation Kit "Motor control Closed-loop System"
This reference board is an evaluation board for Aruduino. It incorporates a TB6605FTG and can be used for prototyping. This system is suitable for small appliances, such as electric fans and water purifiers.
1:52
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Small Package, semi-power discrete - High density mounting -
This video is introducing about US2H and TSOP6F package which have achieved a small and high power disipation. It offers low thermal resistance up to 22% compare with same size package class.
0:55
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Toshiba TVS Diode (Improvement 1st Vpeak : New EAP-V process)
Toshiba's TVS Diode achieves top level low dynamic resistance and low clamping voltages. It protects devices from performance declines and internal circuit destruction. EAP-V offers lower clamping voltage than competitor's processes. It achieves High
3:16
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Double side cooling Package DSOP Advance
Why not realize cooling performance of DSOP Advance package,“Double side cooling” on Toshiba power MOSFETs? We offer a package with double side cooling capability, which has an heat spreader (topside metal plate)...
2:41
