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New package introduction for Automotive MOSFET: DFN2020B(WF)
DFN2020B(WF) package which uses a wettable flank structure, allows for confirmation of solderability in AOI equipment. And it reduces the mounting area by approximately 43% compared to the SOT-23F package while achieving high power dissipation.
3:00
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Introduction of Automotive MOSFETs New SMD package“L-TOGL™”
L-TOGL™ is capable of high-current operation with industry-leading low-loss and low heat generation characteristics achieved through new packaging technology.
2:18
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Introduction of Automotive MOSFETs New SMD Package “S-TOGL™”
S-TOGL™ is a package that achieves a high current density, low-loss and low heat generation characteristics for products through new packaging technology.
2:04
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Introduction of Reference Design of 48V Bus Compatible 1.2V/100A Double Step-Down DC-DC Converter
This is a highly efficient DC-DC converter which converts the 48V bus voltage on a server to 1.2V/100A for various devices in the sever. Design files and guides for circuit design and operation are available as reference design.
3:33
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Power Multiplexer Circuit with Common Drain MOSFET SSM10N961L
This is the introduction to reference design of Power Multiplexer Circuit using MOSFET gate driver. MBB/BBM switching is possible and ideal diode characteristics are realized on a small board.
3:59
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An introduction of High Voltage MOSFET, π-MOSⅨ Series
With an optimized chip design, the π-MOS IX series provides lower peak EMI noise than the current π-MOS VII series, while maintaining the same level of efficiency.
1:16
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Toshiba small discrete semiconductor products for USB Type-C™
Do you need any help for introduction of the Type-C connectors ? Toshiba will propose suitable semiconductor products in power line and data line around the Type-C connector according to customer’s usage conditions.
3:34
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The DTMOSⅥ series High-voltage MOSFET
TOSHIBA DTMOSⅥ series help to improve the efficiency of switching power supply by reduction of Ron・Qgd.
1:06
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The U-MOSⅨ-H 100V series low voltage MOSFETs
We succeeded in improving the efficiency of the U-MOSⅨ-H installed in a DC-DC converter by improving the trade-off between the ON resistance and the electric charge.
1:14
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Small Package, semi-power discrete - High density mounting -
This video is introducing about US2H and TSOP6F package which have achieved a small and high power disipation. It offers low thermal resistance up to 22% compare with same size package class.
0:55
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Double side cooling Package DSOP Advance
Why not realize cooling performance of DSOP Advance package,“Double side cooling” on Toshiba power MOSFETs? We offer a package with double side cooling capability, which has an heat spreader (topside metal plate)...
2:41
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