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可重复使用的电子保险丝，内置FLAG信号输出功能和反向电流阻断功能，有助于保护电路。
东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体，为实现碳中和和抑制功耗增加做出贡献。
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S-TOGL™通过新的封装技术实现了高电流密度、低损耗和低发热量特性。
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The three-phase brushless DC motor drive circuit, which combines six MOSFETs (TPH1R204PB, TPH2R408QM) and a gate driver (TB67Z833SFTG), enables compact yet highly efficient motor control. It supports various input modes. This reference design provide
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Toshiba's Thermoflagger™ ICs combined with PTC thermistors detects over temperature of electronic devices. Thermoflagger™ can offer an inexpensive, low current consumption solution which can detect a wide area of abnormal over temperature conditions.
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Power supplies for servers are now required to be more efficient, more powerful, and more space-saving, making high power density essential. By adopting our latest surface-mounted SiC devices, we have achieved high power density by separating the pow
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TB9M003FG将电机栅极驱动电路、MCU和外围组件集成到一块芯片中。支持无霍尔的1分流矢量控制，有助于实现ECU电路板和系统的小型化，简化电路板和系统的设计
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