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TB9M003FG将电机栅极驱动电路、MCU和外围组件集成到一块芯片中。支持无霍尔的1分流矢量控制，有助于实现ECU电路板和系统的小型化，简化电路板和系统的设计
DFN2020B(WF)封装采用可焊锡侧翼引脚结构，可通过AOI设备确认可焊性。与SOT-23F封装相比，该封装在实现高散热性的同时，减少了约43%的贴装面积。
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该参考设计可在半桥模式下控制两个电机，或在H桥模式下控制一个电机。可使用板载开关或外部MCU控制电机。本参考设计提供设计指南、数据和其他内容。
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The three-phase brushless DC motor drive circuit, which combines six MOSFETs (TPH1R204PB, TPH2R408QM) and a gate driver (TB67Z833SFTG), enables compact yet highly efficient motor control. It supports various input modes. This reference design provide
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TB9033FTG是业界首款具有硬件逻辑并符合车载通信标准的CXPI接口IC（开发中） 该产品无需软件开发，有助于缩短开发周期。
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Bidirectional DC-DC converter required for the applications which have the 48V battery and the 12V battery achieves high efficiency operation by using Toshiba's
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