Toshiba's LDO achieves industry's best-in-1 class ripple rejection ratio and load transient response. This helps to minimize output voltage fluctuations.
This video is introducing about US2H and TSOP6F package which have achieved a small and high power disipation. It offers low thermal resistance up to 22% compare with same size package class.
Do you need any help for introduction of the Type-C connectors ? Toshiba will propose suitable semiconductor products in power line and data line around the Type-C connector according to customer’s usage conditions.
Why not realize cooling performance of DSOP Advance package,“Double side cooling” on Toshiba power MOSFETs? We offer a package with double side cooling capability, which has an heat spreader (topside metal plate)...
TOSHIBA DTMOSⅥ series help to improve the efficiency of switching power supply by reduction of Ron・Qgd.
With an optimized chip design, the π-MOS IX series provides lower peak EMI noise than the current π-MOS VII series, while maintaining the same level of efficiency.
We succeeded in improving the efficiency of the U-MOSⅨ-H installed in a DC-DC converter by improving the trade-off between the ON resistance and the electric charge.