Introduction of Automotive MOSFETs New SMD Package “S-TOGL™”
2:04
S-TOGL™ is a package that achieves a high current density, low-loss and low heat generation characteristics for products through new packaging technology.
Related Videos
In Automotive
-
Play video Interface IC for CXPI Responder TB9033FTG
Interface IC for CXPI Responder TB9033FTG
The TB9033FTG is the industry's first CXPI interface IC with hardware logic for automotive communication standards. (Under development) This product contributes to shortening development period by eliminating the need for software development.
2:35
-
Play video Automotive motor drive gate driver
Automotive motor drive gate driver
Introducing two new gate drivers: TB9103FTG for brushed motors and TB9084FTG for brushless motors. Designed for automotive body systems, electric pumps, and motor generators. This overview shows example applications and each product’s features.
5:18
-
Play video Automotive Brushed DC Motor Driver IC TB9054FTG/TB9053FTG
Automotive Brushed DC Motor Driver IC TB9054FTG/TB9053FTG
The ICs feature 5A 2ch output drivers. 10A 1ch drive in parallel mode is also possible. They can be daisy-chained, and also have functions that control motors only by SPI communication. It is suitable for throttle valves and various engine valves.
2:05
-
Play video H-bridge Pre-Driver IC for EPS and Automotive Body Application TB9057FG
H-bridge Pre-Driver IC for EPS and Automotive Body Application TB9057FG
TB9057FG is a pre-driver IC for automotive DC brushed motor. It has various abnormality detection circuits, and the detection condition can be adjusted by external pin setting.
1:01
-
Play video ASSP introduction for HVAC systems
ASSP introduction for HVAC systems
This video introduces Toshiba ASSP for HVAC systems. The TB9058FNG which is a motor driver capable of LIN communication has been launched for dampers. TOSHIBA ASSP provides a high efficinet system for HAVC.
2:29
-
Play video New package introduction for Automotive MOSFET: DFN2020B(WF)
New package introduction for Automotive MOSFET: DFN2020B(WF)
DFN2020B(WF) package which uses a wettable flank structure, allows for confirmation of solderability in AOI equipment. And it reduces the mounting area by approximately 43% compared to the SOT-23F package while achieving high power dissipation.
3:00