This page partially uses JavaScript. This page may not operate normally when these functions are not supported by your browser or the setting is disabled.Please look for the information you need from the following pages:
0:55
该视频介绍可实现小型化与高耗散功率的US2H和TSOP6F封装。与相同尺寸的其他封装相比它热阻仅为22%。
