Double side cooling Package DSOP Advance

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Why not realize cooling performance of DSOP Advance package,“Double side cooling” on Toshiba power MOSFETs? We offer a package with double side cooling capability, which has an heat spreader (topside metal plate), providing an ultra-low channel-to-case thermal resistance, so that the DSOP Advance packaged MOSFETs enable to simplify thermal design.

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