东芝向功率半导体的进步发起挑战
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东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体,为实现碳中和和抑制功耗增加做出贡献。
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东芝电子元件及存储装置株式会社使用300mm硅晶圆制造功率半导体,为实现碳中和和抑制功耗增加做出贡献。
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